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英文术语完全介绍 在每组术语中,我按照英文字母的排列顺序来分类。
1、CPU 3DNow!(3Dnowaiting,无须等待的3D处理) AAM(AMDAnalystMeeting,AMD分析家会议) ABP(AdvancedBranchPrediction,高级分支预测) ACG(AggressiveClockGating,主动时钟选择) AIS(AlternateInstructionSet,交替指令集) ALAT(advancedloadtable,高级载入表) ALU(ArithmeticLogicUnit,算术逻辑单元) Aluminum(铝) AGU(AddressGenerationUnits,地址产成单元) APC(AdvancedPowerControl,高级能源控制) APIC(AdvancedrogrammableInterruptController,高级可编程中断控制器) APS(AlternatePhaseShifting,交替相位跳转) ASB(AdvancedSystemBuffering,高级系统缓冲) ATC(AdvancedTransferCache,高级转移缓存) ATD(AssemblyTechnologyDevelopment,装配技术发展) BBUL(BumplessBuild-UpLayer,内建非凹凸层) BGA(BallGridArray,球状网阵排列) BHT(branchpredictiontable,分支预测表) Bops(BillionOperationsPerSecond,10亿操作/秒) BPU(BranchProcessingUnit,分支处理单元) BP(BrachPediction,分支预测) BSP(BootStrapProcessor,启动捆绑处理器) BTAC(BranchTargetAddressCalculator,分支目标寻址计算器) CBGA(CeramicBallGridArray,陶瓷球状网阵排列) CDIP(CeramicDual-In-Line,陶瓷双重直线) CenterProcessingUnitUtilization,中央处理器占用率 CFM(cubicfeetperminute,立方英尺/秒) CMT(course-grainedmultithreading,过程消除多线程) CMOS(ComplementaryMetalOxideSemiconductor,互补金属氧化物半导体) CMOV(conditionalmoveinstruction,条件移动指令) CISC(ComplexInstructionSetComputing,复杂指令集计算机) CLK(ClockCycle,时钟周期) CMP(on-chipmultiprocessor,片内多重处理) CMS(CodeMorphingSoftware,代码变形软件) co-CPU(cooperativeCPU,协处理器) COB(Cacheonboard,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度)) COD(CacheonDie,芯片内核集成缓存) Copper(铜) CPGA(CeramicPinGridArray,陶瓷针型栅格阵列) CPI(cyclesperinstruction,周期/指令) CPLD(ComplexProgrammableLogicDevice,複雜可程式化邏輯元件) CPU(CenterProcessingUnit,中央处理器) CRT(CooperativeRedundantThreads,协同多余线程) CSP(ChipScalePackage,芯片比例封装) CXT(ChoopereXTend,增强形K6-2内核,即K6-3) DataForwarding(数据前送) dB(decibel,分贝) DCLK(DotClock,点时钟) DCT(DRAMController,DRAM控制器) DDT(DynamicDeferredTransaction,动态延期处理) Decode(指令解码) DIB(DualIndependentBus,双重独立总线) DMT(DynamicMultithreadingArchitecture,动态多线程结构)
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